Invention Application
- Patent Title: CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME, PHOTOSENSITIVE RESIN LAYER, COLOR FILTER AND CMOS IMAGE SENSOR
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Application No.: US17557718Application Date: 2021-12-21
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Publication No.: US20220204775A1Publication Date: 2022-06-30
- Inventor: Sundae KIM , Yeji YANG , Young LEE , Chaehyuk KO , Ieju KIM , Arum YU , Myungho CHO , Xinhui FENG
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Priority: KR10-2020-0186683 20201229
- Main IPC: C09B57/00
- IPC: C09B57/00 ; H01L27/146 ; G02B5/22 ; G02B1/04 ; C09B67/08 ; C08L33/08 ; C08L33/10
Abstract:
A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a squarylium core including three or more (meth)acrylate groups and a shell surrounding the squarylium core.
Public/Granted literature
Information query
