Invention Application
- Patent Title: COPPER ALLOYS WITH HIGH STRENGTH AND HIGH CONDUCTIVITY, AND PROCESSES FOR MAKING SUCH COPPER ALLOYS
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Application No.: US17603187Application Date: 2020-04-09
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Publication No.: US20220205074A1Publication Date: 2022-06-30
- Inventor: Carole L. Trybus , John C. Kuli , Christopher J. Taylor
- Applicant: MATERION CORPORATION
- Applicant Address: US OH Mayfield Heights
- Assignee: MATERION CORPORATION
- Current Assignee: MATERION CORPORATION
- Current Assignee Address: US OH Mayfield Heights
- International Application: PCT/US2020/027404 WO 20200409
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C21D8/02 ; C22C9/00
Abstract:
A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.
Public/Granted literature
- US12037671B2 Copper alloys with high strength and high conductivity, and processes for making such copper alloys Public/Granted day:2024-07-16
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