Invention Application
- Patent Title: PATTERN ANALYSIS SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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Application No.: US17547503Application Date: 2021-12-10
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Publication No.: US20220207699A1Publication Date: 2022-06-30
- Inventor: Min-Cheol KANG , Dong Hoon KUK
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-SI
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-SI
- Priority: KR10-2020-0187014 20201230
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T5/00 ; G06T7/13 ; G06T7/30

Abstract:
A method of manufacturing a semiconductor device that includes providing a substrate having a pattern formed thereon. A scanning electron microscope (SEM) image is generated that includes a boundary image showing an edge of the pattern. A blended image is generated by performing at least one blending operation on the SEM image and a background image aligned with the boundary image. Contour data is generated by binarizing the blended image on a basis of a threshold value. The threshold value is determined by a critical dimension of the pattern.
Public/Granted literature
- US12062164B2 Pattern analysis system and method of manufacturing semiconductor device using the same Public/Granted day:2024-08-13
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