Invention Application
- Patent Title: HYPERBARIC SAW FOR SAWING PACKAGED DEVICES
-
Application No.: US17139072Application Date: 2020-12-31
-
Publication No.: US20220208571A1Publication Date: 2022-06-30
- Inventor: Byron Harry Gibbs , Michael Todd Wyant
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/78 ; H01L23/00 ; H01L21/48 ; H01L21/56
Abstract:
In a described example, an apparatus includes: a process chamber configured for a pressure greater than one atmosphere, having a device chuck configured to support electronic devices that are mounted on package substrates and partially covered in mold compound, the electronic devices spaced from one another by saw streets; and a saw in the process chamber configured to cut through the mold compound and package substrates in the saw streets to separate the molded electronic devices one from another.
Public/Granted literature
- US11676829B2 Hyperbaric saw for sawing packaged devices Public/Granted day:2023-06-13
Information query
IPC分类:
