Invention Application
- Patent Title: CHIP PACKAGING STRUCTURE
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Application No.: US17565402Application Date: 2021-12-29
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Publication No.: US20220208628A1Publication Date: 2022-06-30
- Inventor: Shih-Chieh Lin , Yong-Zhong Hu , Heng-Chi Huang , Hao-Lin Yen
- Applicant: Richtek Technology Corporation
- Applicant Address: TW Zhubei City
- Assignee: Richtek Technology Corporation
- Current Assignee: Richtek Technology Corporation
- Current Assignee Address: TW Zhubei City
- Priority: TW110115026 20210427
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/15 ; H01L23/495 ; H01L23/367
Abstract:
A chip packaging structure includes: at least one semiconductor chip, having a signal processing function; a base material, wherein the semiconductor chip is disposed on the base material; at least one thermal conduction plate, disposed on the base material; and a package material, encapsulating the base material, the thermal conduction plate, and the semiconductor chip. The thermal conduction plate forms at least one thermal conduction channel in the package material.
Information query
IPC分类:
