公开(公告)号：US20220157622A1

公开(公告)日：2022-05-19

申请号：US17485339

申请日：2021-09-25

Applicant: Richtek Technology Corporation

Inventor： Heng-Chi Huang ,  Yong-Zhong Hu ,  Hao-Lin Yen

IPC: H01L21/48 ,  H01L21/683 ,  H01L21/78 ,  H01L23/373

Abstract: A chip packaging method includes: providing plural chip units; providing a base material, and placing the chip units on the base material; providing an adhesive layer to adhere a metal foil to the chip unit, wherein the metal foil is a part of the base material or additional to the base material; and cutting the chip units on the base material to form plural separated chip package units, wherein each of the chip package units includes a cut metal foil part.

公开(公告)号：US20220181237A1

公开(公告)日：2022-06-09

申请号：US17356810

申请日：2021-06-24

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/495

Abstract: The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.

公开(公告)号：US11973010B2

公开(公告)日：2024-04-30

申请号：US17490038

申请日：2021-09-30

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952

Abstract: A chip packaging method includes: providing a wafer, on which multiple bumps are formed; cutting the wafer into multiple chip units, wherein multiple vertical heat conduction elements are formed on the wafer or the chip units; disposing the chip units on a base material; and providing a package material to encapsulate lateral sides and a bottom surface of each of the chip units, to form a chip package unit, wherein the bottom surface of the chip unit faces the base material; wherein, in the chip package unit, the bumps on the chip units abut against the base material, and wherein the vertical heat conduction elements directly connect to the base material, or the base material includes multiple through-holes and the vertical heat conduction elements pass through the multiple through-holes in the base material.

公开(公告)号：US20220367309A1

公开(公告)日：2022-11-17

申请号：US17718125

申请日：2022-04-11

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/34 ,  H01L23/31 ,  H01L21/56

Abstract: A chip package unit includes: a base material; at least one chip, disposed on the base material; a package material, enclosing the base material and the chip; and at least one heat dissipation paste curing layer, formed by curing the heat dissipation paste, on a top side of the package material or a back side of the chip in a printed pattern.

公开(公告)号：US11469162B2

公开(公告)日：2022-10-11

申请号：US17356810

申请日：2021-06-24

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/28 ,  H01L21/00 ,  H05K7/20 ,  H01L23/31 ,  H01L25/07 ,  H01L23/14 ,  H01L25/075 ,  H01L23/00 ,  H01L23/40

Abstract: The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.

公开(公告)号：US20240234264A1

公开(公告)日：2024-07-11

申请号：US18616275

申请日：2024-03-26

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952

Abstract: A chip packaging method includes: providing a wafer, on which multiple bumps are formed; cutting the wafer into multiple chip units, wherein multiple vertical heat conduction elements are formed on the wafer or the chip units; disposing the chip units on a base material; and providing a package material to encapsulate lateral sides and a bottom surface of each of the chip units, to form a chip package unit, wherein the bottom surface of the chip unit faces the base material; wherein, in the chip package unit, the bumps on the chip units abut against the base material, and wherein the vertical heat conduction elements directly connect to the base material, or the base material includes multiple through-holes and the vertical heat conduction elements pass through the multiple through-holes in the base material.

公开(公告)号：US20230098393A1

公开(公告)日：2023-03-30

申请号：US17847231

申请日：2022-06-23

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes: at least one ductile structure, including a bond area, a die paddle, or a lead finger; and at least one sacrificial structure, connected between a corresponding ductile structure and a corresponding near portion in the lead frame, wherein the near portion is a portion of the lead frame close to the ductile structure.

公开(公告)号：US20220208628A1

公开(公告)日：2022-06-30

申请号：US17565402

申请日：2021-12-29

Applicant: Richtek Technology Corporation

Inventor： Shih-Chieh Lin ,  Yong-Zhong Hu ,  Heng-Chi Huang ,  Hao-Lin Yen

IPC: H01L23/31 ,  H01L23/15 ,  H01L23/495 ,  H01L23/367

Abstract: A chip packaging structure includes: at least one semiconductor chip, having a signal processing function; a base material, wherein the semiconductor chip is disposed on the base material; at least one thermal conduction plate, disposed on the base material; and a package material, encapsulating the base material, the thermal conduction plate, and the semiconductor chip. The thermal conduction plate forms at least one thermal conduction channel in the package material.

公开(公告)号：US20220181238A1

公开(公告)日：2022-06-09

申请号：US17490038

申请日：2021-09-30

Applicant: Richtek Technology Corporation

Inventor： Hao-Lin Yen ,  Heng-Chi Huang ,  Yong-Zhong Hu

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A chip packaging method includes: providing a wafer, on which multiple bumps are formed; cutting the wafer into multiple chip units, wherein multiple vertical heat conduction elements are formed on the wafer or the chip units; disposing the chip units on a base material; and providing a package material to encapsulate lateral sides and a bottom surface of each of the chip units, to form a chip package unit, wherein the bottom surface of the chip unit faces the base material; wherein, in the chip package unit, the bumps on the chip units abut against the base material, and wherein the vertical heat conduction elements directly connect to the base material, or the base material includes multiple through-holes and the vertical heat conduction elements pass through the multiple through-holes in the base material.