发明申请
- 专利标题： SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED CHIP PACKAGE
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申请号： US17696910申请日： 2022-03-17
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公开(公告)号： US20220208680A1公开(公告)日： 2022-06-30
- 发明人: Po-Yuan Teng , Hung-Yi Kuo , Hao-Yi Tsai , Tin-Hao Kuo , Yu-Chia Lai , Shih-Wei Chen
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/31 ; H01L23/473 ; H01L21/56 ; H01L21/48
摘要：
A semiconductor device includes a first chip package, a heat dissipation structure and an adapter. The first chip package includes a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die has an active surface and a back surface opposite to the active surface. The heat dissipation structure is connected to the chip package. The adapter is disposed over the first chip package and electrically connected to the semiconductor die.
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