This disclosure describes manufacture of a mixture and use of same to fabricate different types of electronic components. In one configuration, the mixture includes: first particles, the first particles being an insulator material; second particles, the second particles being electrically conductive metal material; and a combination of the first particles and the second particles suspended in a printable liquid medium, the printable liquid/solid medium (slurry) being curable into a dielectric layer of material. According to one configuration, the printable material is disposed and cured on a substrate. The first particles and second particles are randomly distributed in the cured printed material (dielectric material). The second particles in the cured dielectric material are transformable into one or more electrically conductive paths, electronic components, etc., via application of heat above a threshold value. Thus, a dielectric (insulator) material can be transformed into an electrically conductive path via application of heat.