Invention Application
- Patent Title: PRINTED STACKED MICRO-DEVICES
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Application No.: US17146295Application Date: 2021-01-11
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Publication No.: US20220225508A1Publication Date: 2022-07-14
- Inventor: Ronald S. Cok
- Applicant: X-Celeprint Limited
- Applicant Address: IE Dublin
- Assignee: X-Celeprint Limited
- Current Assignee: X-Celeprint Limited
- Current Assignee Address: IE Dublin
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L25/065 ; H05K1/02 ; H05K1/11 ; H05K1/16

Abstract:
A stacked electronic component comprises a stack of three or more print layers. Each print layer has an area less than any print layers beneath the print layer in the stack. Each print layer comprises a dielectric layer and a functional layer disposed on the dielectric layer. The functional layer comprises an exposed conductive portion that is not covered with a dielectric layer of any of the print layers and each exposed conductive portion is nonoverlapping with any other exposed conductive portion. A patterned electrode layer is coated on at least a portion of the stack and defines one or more electrodes. Each electrode of the one or more electrodes in electrical contact with an exclusive subset of the exposed conductive portions. The functional layers can be passive conductors forming capacitors, resistors, inductors, or antennas, or active layers forming electronic circuits.
Public/Granted literature
- US11490519B2 Printed stacked micro-devices Public/Granted day:2022-11-01
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