公开(公告)号：US20240347367A1

公开(公告)日：2024-10-17

申请号：US18294754

申请日：2021-08-09

申请人： X-Celeprint Limited ,  LEONHARD KURZ Stiftung & Co. KG

发明人： Ronald S. Cok ,  António José Marques Trindade ,  MIchael Scharfenberg ,  Christian Schulz ,  Gabriele Roithmeier

IPC分类号： H01L21/683 ,  H01L23/00

CPC分类号： H01L21/6835 ,  H01L24/27 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/27515 ,  H01L2224/27848 ,  H01L2224/8312 ,  H01L2224/98 ,  H01L2924/15156

摘要： A module collection and deposition system comprises a container, a module source wafer comprising modules released from the module source wafer, a module collection device operable to remove the modules from the module source wafer and dispose the modules as a disordered and dry collection into the container, and a module deposition device for removing the modules from the container and randomly disposing the modules on a receiving surface. Each module comprises an electronically active unpackaged component.

公开(公告)号：US20240295692A1

公开(公告)日：2024-09-05

申请号：US18593039

申请日：2024-03-01

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  David Gomez

IPC分类号： G02B6/122 ,  G02B6/12 ,  G02B6/136

CPC分类号： G02B6/122 ,  G02B6/12004 ,  G02B6/136

摘要： A micro-optical structure includes a structure substrate comprising a cavity and a micro-optical component disposed entirely and directly over or in the cavity. The micro-optical component includes a micro-optical element and a component tether physically attached to an anchor portion of the structure substrate and in contact with the micro-optical element. The structure substrate and the micro-optical component can be monolithic, for example unitary and comprise a same material or are the same material. The micro-optical component can be disposed on a sacrificial portion disposed on a micro-optical component source wafer differentially etchable form the sacrificial portion. The micro-optical component can be disposed on a micro-optical component source wafer patterned with an encapsulation layer where the micro-optical component is differentially etchable from the encapsulation layer and the micro-optical component.

公开(公告)号：US20240231017A1

公开(公告)日：2024-07-11

申请号：US18405572

申请日：2024-01-05

申请人： X-Celeprint Limited

发明人： Ronald S. Cok

IPC分类号： G02B6/42

CPC分类号： G02B6/4214 ,  G02B6/4206 ,  G02B6/423

摘要： A micro-optical component includes a micro-substrate, a micro-optical element disposed on the micro-substrate, and a stand-off (a mechanical spacer) disposed on the micro-substrate or micro-optical component in a separate plane from the micro-substrate that at least partially encloses the micro-optical element. The micro-optical components can be stacked on a system substrate using micro-transfer printing to form a three-dimensional micro-optical structure. One more light beams can travel or pass through various combinations of multiple micro-optical components and micro-optical elements.

公开(公告)号：US20230336150A1

公开(公告)日：2023-10-19

申请号：US17721766

申请日：2022-04-15

申请人： X-Celeprint Limited

发明人： António José Marques Trindade ,  Ronald S. Cok ,  Raja Fazan Gul

IPC分类号： H03H9/05 ,  H03H3/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/17 ,  B41F16/00

CPC分类号： H03H9/0595 ,  H03H3/02 ,  H03H9/02031 ,  H03H9/105 ,  H03H9/176 ,  B41F16/00

摘要： According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.

公开(公告)号：US11670603B2

公开(公告)日：2023-06-06

申请号：US17366842

申请日：2021-07-02

申请人： X-Celeprint Limited

发明人： António José Marques Trindade ,  Ronald S. Cok

IPC分类号： H01L23/58 ,  H01L23/544

CPC分类号： H01L23/58 ,  H01L23/544 ,  H01L2223/54426

摘要： A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.

公开(公告)号：US20230131998A1

公开(公告)日：2023-04-27

申请号：US17968418

申请日：2022-10-18

申请人： X-Celeprint Limited

发明人： David Gomez ,  Ronald S. Cok

IPC分类号： H01L21/027 ,  H01L21/768 ,  H01L21/311

摘要： A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.

公开(公告)号：US11637540B2

公开(公告)日：2023-04-25

申请号：US16669499

申请日：2019-10-30

申请人： X-Celeprint Limited

发明人： António José Marques Trindade ,  Lei Liu ,  Ronald S. Cok

IPC分类号： H03H9/02 ,  H03H3/02

摘要： A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.

公开(公告)号：US20220112078A1

公开(公告)日：2022-04-14

申请号：US17066448

申请日：2020-10-08

申请人： X-Celeprint Limited

发明人： Pierluigi Rubino

IPC分类号： B81C1/00

摘要： A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

公开(公告)号：US20210342659A1

公开(公告)日：2021-11-04

申请号：US16865257

申请日：2020-05-01

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  Robert R. Rotzoll

IPC分类号： G06K19/02 ,  G06K19/07 ,  G06K19/077

摘要： A hybrid document includes a flexible document having visible markings. One or more light-controlling elements and a controller are embedded in or on the flexible document. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. In some embodiments, the controller includes a memory and a value can be stored in the memory and displayed by the light-controlling element(s). In some embodiments, the value can be assigned or varied by a hybrid currency teller machine.

公开(公告)号：US11152395B1

公开(公告)日：2021-10-19

申请号：US17096688

申请日：2020-11-12

申请人： X-Celeprint Limited

发明人： Joseph Carr ,  Ronald S. Cok

IPC分类号： H01L27/12 ,  H01L21/84 ,  H01L21/78 ,  H01L29/76

摘要： A monolithic multi-FET transistor comprises an epitaxial layer disposed on a dielectric layer. The epitaxial layer comprises a crystalline semiconductor material and a multi-FET area. An isolation structure surrounds the multi-FET area and divides the multi-FET area into separate FET portions. A gate disposed on a gate dielectric extends over each FET portion. A source and a drain are each disposed on opposite sides of the gate on the epitaxial layer within each FET portion. Each gate, source, and drain comprise a separate electrical conductor and the gate, source, drain, and epitaxial layer within each FET portion form a field-effect transistor. Gate, source, and drain contacts electrically connect the gates, sources, and drains of the separate FET portions, respectively. At least the sources or drains of two neighboring FET portions are disposed in common over at least a portion of the isolation structure dividing the two neighboring FET portions.