Invention Application
- Patent Title: CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME
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Application No.: US17584788Application Date: 2022-01-26
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Publication No.: US20220230788A1Publication Date: 2022-07-21
- Inventor: Kazuhisa USHIYAMA
- Applicant: KOA CORPORATION
- Applicant Address: JP INA-SHI
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP INA-SHI
- Priority: JP2021-005107 20210115
- Main IPC: H01C1/14
- IPC: H01C1/14 ; H01C7/00 ; H01C17/00

Abstract:
A glass protective film 4 is formed such that boundaries of top surface electrodes 3a and 3b do not exist at the base of corner portions of the rectangular glass protective film 4 so as to eliminate level differences generating due to thicknesses of the electrodes. Use of such a structure may resolve the problem that when printing glass paste individually over chip elements of a chip resistor on a large substrate from which multiple chips will be obtained, corner portions of the glass protective film bleed (flow) to the outer side (dividing grooves).
Public/Granted literature
- US11626219B2 Chip resistor and method for manufacturing same Public/Granted day:2023-04-11
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