Invention Application
- Patent Title: Liquid Ejecting Head And Liquid Ejecting Apparatus
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Application No.: US17582304Application Date: 2022-01-24
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Publication No.: US20220234350A1Publication Date: 2022-07-28
- Inventor: Kentaro MURAKAMI , Hiroaki OKUI
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2021-009363 20210125
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/175

Abstract:
A liquid ejecting head includes: a nozzle; a flow path member in which a flow path communicating with the nozzle is formed and which has an inner wall surface defining the flow path and an outer wall surface that faces away from the flow path with respect to the inner wall surface; and a temperature sensor disposed on a part of the outer wall surface and configured to detect a temperature of the liquid in the flow path. The flow path includes a narrowed region having a narrow width in a second direction orthogonal to a first direction in a direction in which the flow path extends, and the temperature sensor is disposed on a portion of the outer wall surface that forms the narrowed region.
Public/Granted literature
- US11865836B2 Liquid ejecting head and liquid ejecting apparatus Public/Granted day:2024-01-09
Information query
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