Invention Application
- Patent Title: Integrated Photonics Device Having Integrated Edge Outcouplers
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Application No.: US17575326Application Date: 2022-01-13
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Publication No.: US20220236503A1Publication Date: 2022-07-28
- Inventor: Michael J. Bishop , Vijay M. Iyer , Jason S. Pelc , Mario J. Costello
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G01N21/47 ; G01N21/49

Abstract:
Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.
Public/Granted literature
- US11960131B2 Integrated photonics device having integrated edge outcouplers Public/Granted day:2024-04-16
Information query