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公开(公告)号：US11171464B1
公开(公告)日：2021-11-09
申请号：US16714575
申请日：2019-12-13
申请人： Apple Inc.
发明人： Michael J. Bishop , Jason Pelc , Vijay M. Iyer , Alex Goldis
IPC分类号： H01S5/02355 , G02B6/13 , H01S5/0234 , H01S5/02234 , H01S5/02251 , H01S5/02345 , G02B6/12 , H01S5/024
摘要： Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.
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公开(公告)号：US20210033805A1
公开(公告)日：2021-02-04
申请号：US16969034
申请日：2019-02-13
申请人： Apple Inc.
摘要： Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.
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公开(公告)号：US20240272380A1
公开(公告)日：2024-08-15
申请号：US18634911
申请日：2024-04-13
申请人： Apple Inc.
CPC分类号： G02B6/4204 , G02B6/4206 , G02B6/4219 , G02B6/4244 , G02B6/4296 , G02B19/0057 , G02B6/30 , G02B6/4262
摘要： A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
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公开(公告)号：US11585749B2
公开(公告)日：2023-02-21
申请号：US17063483
申请日：2020-10-05
申请人： Apple Inc.
发明人： Miikka M. Kangas , Mark Alan Arbore , David I. Simon , Michael J. Bishop , James W. Hillendahl , Robert Chen
IPC分类号： G01N21/27 , G01N21/35 , G01N21/47 , G01J3/32 , G01J3/36 , G01J3/433 , G01J3/447 , G01J3/02 , G01J3/42 , G01N21/49 , G01N21/21
摘要： This relates to systems and methods for measuring a concentration and type of substance in a sample at a sampling interface. The systems can include a light source, optics, one or more modulators, a reference, a detector, and a controller. The systems and methods disclosed can be capable of accounting for drift originating from the light source, one or more optics, and the detector by sharing one or more components between different measurement light paths. Additionally, the systems can be capable of differentiating between different types of drift and eliminating erroneous measurements due to stray light with the placement of one or more modulators between the light source and the sample or reference. Furthermore, the systems can be capable of detecting the substance along various locations and depths within the sample by mapping a detector pixel and a microoptics to the location and depth in the sample.
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公开(公告)号：US20220128782A1
公开(公告)日：2022-04-28
申请号：US17508760
申请日：2021-10-22
申请人： Apple Inc.
摘要： A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
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公开(公告)号：US20210018432A1
公开(公告)日：2021-01-21
申请号：US17063483
申请日：2020-10-05
申请人： Apple Inc.
发明人： Miikka M. Kangas , Mark Alan Arbore , David I. Simon , Michael J. Bishop , James W. Hillendahl , Robert Chen
IPC分类号： G01N21/27 , G01N21/35 , G01N21/47 , G01J3/32 , G01J3/36 , G01J3/433 , G01J3/447 , G01J3/02 , G01J3/42
摘要： This relates to systems and methods for measuring a concentration and type of substance in a sample at a sampling interface. The systems can include a light source, optics, one or more modulators, a reference, a detector, and a controller. The systems and methods disclosed can be capable of accounting for drift originating from the light source, one or more optics, and the detector by sharing one or more components between different measurement light paths. Additionally, the systems can be capable of differentiating between different types of drift and eliminating erroneous measurements due to stray light with the placement of one or more modulators between the light source and the sample or reference. Furthermore, the systems can be capable of detecting the substance along various locations and depths within the sample by mapping a detector pixel and a microoptics to the location and depth in the sample.
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公开(公告)号：US11881678B1
公开(公告)日：2024-01-23
申请号：US17015766
申请日：2020-09-09
申请人： Apple Inc.
CPC分类号： H01S5/0071 , G02B3/06 , G02B6/12 , G02B26/0833 , G02B26/105 , H01S5/4043 , H01S5/4087
摘要： Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.
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公开(公告)号：US20220236503A1
公开(公告)日：2022-07-28
申请号：US17575326
申请日：2022-01-13
申请人： Apple Inc.
摘要： Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.
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公开(公告)号：US20220131340A1
公开(公告)日：2022-04-28
申请号：US17519355
申请日：2021-11-04
申请人： Apple Inc.
发明人： Michael J. Bishop , Jason Pelc , Vijay M. Iyer , Alex Goldis
IPC分类号： H01S5/02355 , G02B6/13 , H01S5/0234 , H01S5/02234 , H01S5/02251 , H01S5/02345
摘要： Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.
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公开(公告)号：US10964873B1
公开(公告)日：2021-03-30
申请号：US15873767
申请日：2018-01-17
申请人： Apple Inc.
摘要： This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.
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