- 专利标题： Seamless Interconnect Thresholds using Dielectric Fluid Channels
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申请号： US17573874申请日： 2022-01-12
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公开(公告)号： US20220238401A1公开(公告)日： 2022-07-28
- 发明人: Jason Benoit , Nicholas Willey , Paul I. Deffenbaugh , Casey W. Perkowski , Samuel LeBlanc , Evan McDowell , Kenneth H. Church
- 申请人： Sciperio, Inc
- 申请人地址： US FL Orlando
- 专利权人： Sciperio, Inc
- 当前专利权人： Sciperio, Inc
- 当前专利权人地址： US FL Orlando
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L23/00 ; H01L21/48
摘要：
A method may include forming a cavity within a plastic structure with a channel positioned at a perimeter of the cavity, inserting the electronic component into the cavity, dispensing a dielectric fluid into the channel at the perimeter of the cavity, curing the dielectric fluid in situ to secure the electronic component within the cavity with a cured dielectric and printing interconnects for the electronic component.
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