A vehicular camera assembly includes a camera housing and first and second PCBs disposed in the camera housing. Circuitry of the first PCB is in board-to-board electrically-conductive connection with circuitry of the second PCB. The circuitry of the first PCB includes an imager and the second PCB includes a circuit board connector. An electrical connector is disposed at a second portion of the camera housing. A first end of the electrical connector electrically-conductively connects with the circuit board connector when the second portion of the camera housing is being joined with a first portion of the camera housing. Individual pin-receiving sockets of the circuit board connector are configured to accommodate tolerances when respective individual pins of the first end of the electrical connector are being inserted into the respective individual pin-receiving sockets when the second portion is being joined with the first portion of the camera housing.