Invention Application
- Patent Title: PACKAGE STRUCTURE HAVING SOLDER MASK LAYER WITH LOW DIELECTRIC CONSTANT AND METHOD OF FABRICATING THE SAME
-
Application No.: US17198287Application Date: 2021-03-11
-
Publication No.: US20220240367A1Publication Date: 2022-07-28
- Inventor: Ming-Hao WU , Kuo-Wei LI
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Priority: TW110102738 20210125
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/28 ; B01J13/18 ; B01J13/20 ; C09D11/10
Abstract:
A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.
Information query
