Coupling between inductors is restrained, and the layout area of a substrate is also ensured. A high-frequency module includes a mounting substrate, a first inductor, a second inductor, at least one high-frequency component, a shield layer, and a conductive member. The mounting substrate has a main surface. The first inductor is located on a main surface side of the mounting substrate. The second inductor is located on the main surface side of the mounting substrate. The high-frequency component is located on the main surface side of the mounting substrate and between the first inductor and the second inductor. The shield layer is connected to the ground. The conductive member connects the high-frequency component and the shield layer. The conductive member is connected to a main surface of the high-frequency component, the main surface facing the shield layer.