Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Application No.: US17608189Application Date: 2020-04-28
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Publication No.: US20220246763A1Publication Date: 2022-08-04
- Inventor: Shunpei YAMAZAKI , Tsutomu MURAKAWA , Yoshinori ANDO , Tetsuya KAKEHATA , Yuichi SATO , Ryota HODO
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Priority: JP2019-089721 20190510
- International Application: PCT/IB2020/053961 WO 20200428
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L27/108

Abstract:
A semiconductor device with less variations in transistor characteristics is provided. The semiconductor device includes: a first insulator; a first oxide over the first insulator; a first conductor and a second conductor over the first oxide; a first layer and a second layer which are in contact with a side surface of the first oxide; a second insulator over the first insulator, the first layer, the second layer, the first conductor, and the second conductor; a third insulator over the second insulator; a second oxide between the first conductor and the second conductor and over the first oxide; a fourth insulator over the second oxide; and a third conductor over the fourth insulator. Each of the first layer and the second layer includes a metal contained in the first conductor and the second conductor. The first insulator in a region in contact with the second insulator includes a region where a concentration of the metal is lower than that of the first layer or the second layer.
Public/Granted literature
- US12283632B2 Semiconductor device and method for manufacturing semiconductor device Public/Granted day:2025-04-22
Information query
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