Invention Application
- Patent Title: METAMATERIAL EDGE COUPLERS IN THE BACK-END-OF-LINE STACK OF A PHOTONICS CHIP
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Application No.: US17173639Application Date: 2021-02-11
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Publication No.: US20220252785A1Publication Date: 2022-08-11
- Inventor: Yusheng Bian , Roderick A. Augur , Kenneth J. Giewont , Karen Nummy
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G02B6/122
- IPC: G02B6/122 ; F21V8/00 ; G02B6/14

Abstract:
Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure includes a waveguide core over a dielectric layer, and a back-end-of-line stack over the waveguide core and the dielectric layer. The back-end-of-line stack includes an interlayer dielectric layer, a side edge, a first feature, a second feature, and a third feature laterally arranged between the first feature and the second feature. The first feature, the second feature, and the third feature are positioned on the interlayer dielectric layer adjacent to the side edge, and the third feature has an overlapping relationship with a tapered section of the waveguide core.
Public/Granted literature
- US11567261B2 Metamaterial edge couplers in the back-end-of-line stack of a photonics chip Public/Granted day:2023-01-31
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