Invention Application
- Patent Title: Millimeter-Wave Assembly
-
Application No.: US17678695Application Date: 2022-02-23
-
Publication No.: US20220255237A1Publication Date: 2022-08-11
- Inventor: Jari Kristian Van Wonterghem , Alexander Khripkov , Dong Liu , Janne Ilvonen , Jian Ou , Ruiyuan Tian , Changnian Xu , Wei Huang , Zlatoljub Milosavljevic
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q1/24

Abstract:
A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.
Public/Granted literature
- US11855350B2 Millimeter-wave assembly Public/Granted day:2023-12-26
Information query