- 专利标题: CURABLE RESIN COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM
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申请号: US17597087申请日: 2020-08-28
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公开(公告)号: US20220260911A1公开(公告)日: 2022-08-18
- 发明人: Seungeun LEE , Dongju SHIN , Ji Yoon KIM , Jeehyun RYU , Minji SO
- 申请人: SAMSUNG SDI CO., LTD.
- 申请人地址: KR Yongin-si, Gyeonggi-do
- 专利权人: SAMSUNG SDI CO., LTD.
- 当前专利权人: SAMSUNG SDI CO., LTD.
- 当前专利权人地址: KR Yongin-si, Gyeonggi-do
- 优先权: KR10-2019-0109738 20190904,KR10-2020-0072231 20200615
- 国际申请: PCT/KR2020/011554 WO 20200828
- 主分类号: G03F7/075
- IPC分类号: G03F7/075 ; G03F7/004
摘要:
A curable resin composition comprising (A) a silicone-based polymer, the surface, and (C) a solvent.