- 专利标题: SYSTEMS AND METHODS FOR FABRICATING SUPERCONDUCTING INTEGRATED CIRCUITS
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申请号: US17681303申请日: 2022-02-25
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公开(公告)号: US20220263007A1公开(公告)日: 2022-08-18
- 发明人: Trevor M. Lanting , Danica W. Marsden , Byong Hyop Oh , Eric G. Ladizinsky , Shuiyuan Huang , J. Jason Yao , Douglas P. Stadtler
- 申请人: D-WAVE SYSTEMS INC.
- 申请人地址: CA Burnaby
- 专利权人: D-WAVE SYSTEMS INC.
- 当前专利权人: D-WAVE SYSTEMS INC.
- 当前专利权人地址: CA Burnaby
- 主分类号: H01L39/02
- IPC分类号: H01L39/02 ; G06N10/00 ; H01L39/22 ; H01L39/24
摘要:
Systems and methods for fabricating a superconducting integrated circuit that includes wiring layers comprising low-noise material are described. A superconducting integrated circuit can be implemented in a computing system that includes a quantum processor. Such a superconducting integrated circuit includes a first set of one or more wiring layers that form a noise-susceptible superconducting device that can decrease processor when exposed to noise. The superconducting integrated circuit can further include a second set of one or more wiring layers that form a superconducting device that is less susceptible to noise. Fabricating a superconducting device that contains low-noise material can include depositing and patterning a wiring layer comprising a first material that is superconductive in a respective range of temperatures and depositing and patterning a different wiring layer comprising a second material that is superconductive in a respective range of temperatures. The second material can be considered a low-noise material.
公开/授权文献
- US11856871B2 Quantum processors 公开/授权日:2023-12-26
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