Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
-
Application No.: US17740926Application Date: 2022-05-10
-
Publication No.: US20220270948A1Publication Date: 2022-08-25
- Inventor: Hiroshi UKEGAWA , Takanori KAWASHIMA , Akinori SAKAKIBARA
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya-city
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya-city
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/373

Abstract:
The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.
Information query
IPC分类: