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    SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20250069967A1

    公开(公告)日：2025-02-27

    申请号：US18928536

    申请日：2024-10-28

    Applicant: DENSO CORPORATION

    Inventor： Akinori SAKAKIBARA ,  Takanori KAWASHIMA ,  Shingo TSUCHIMOCHI ,  Shoichiro OMAE

    IPC: H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07

    Abstract: A semiconductor device includes a first insulating circuit board, a semiconductor element on the first insulating circuit board, and an encapsulating body. The first insulating circuit board includes a first insulating substrate, and a first inner conductor layer, and a first outer conductor layer. The first inner conductor layer is electrically connected to a first electrode of the semiconductor element inside of the encapsulating body. The first outer conductor layer is exposed from a surface of the encapsulating body. The first inner conductor layer has a first thin-wall portion a thickness of which reduces toward an outer side, along an outer peripheral edge of the first inner conductor layer with a first width. The first outer conductor layer (i) does not have or (ii) has a second thin-wall portion along the outer peripheral edge of the first outer conductor layer with a second width.

    SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220278006A1

    公开(公告)日：2022-09-01

    申请号：US17746492

    申请日：2022-05-17

    Applicant: DENSO CORPORATION

    Inventor： Akinori SAKAKIBARA ,  Takanori KAWASHIMA ,  Shingo TSUCHIMOCHI ,  Shoichiro OMAE

    IPC: H01L23/13 ,  H01L23/498 ,  H01L23/31

    Abstract: A semiconductor device includes a first insulating circuit board, a semiconductor element on the first insulating circuit board, and an encapsulating body. The first insulating circuit board includes a first insulating substrate, and a first inner conductor layer, and a first outer conductor layer. The first inner conductor layer is electrically connected to a first electrode of the semiconductor element inside of the encapsulating body. The first outer conductor layer is exposed from a surface of the encapsulating body. The first inner conductor layer has a first thin-wall portion a thickness of which reduces toward an outer side, along an outer peripheral edge of the first inner conductor layer with a first width. The first outer conductor layer (i) does not have or (ii) has a second thin-wall portion along the outer peripheral edge of the first outer conductor layer with a second width.

    SEMICONDUCTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20240421132A1

    公开(公告)日：2024-12-19

    申请号：US18817993

    申请日：2024-08-28

    Applicant: DENSO CORPORATION

    Inventor： Shingo TSUCHIMOCHI ,  Takanori KAWASHIMA

    IPC: H01L25/07 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

    Abstract: A semiconductor device includes a semiconductor element, a substrate, a bonding material, a main terminal and a plating film. The substrate has an insulating base member, a front surface metal body on a front surface of the insulating base member and electrically connected to a main electrode of the semiconductor element, and a back surface metal body on a back surface of the insulating base member. The bonding material is interposed between the main electrode and the front surface metal body. The main terminal has a solid-state bonded portion bonded to the front surface metal body. The plating film is disposed on the front surface metal body and the main terminal to cover the solid-state bonded portion. The main terminal includes a wide terminal having one solid-state bonded portion and having an overlapping region a width of which is greater than the solid-state bonded portion.

    SEMICONDUCTOR DEVICE
    6.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20240087978A1

    公开(公告)日：2024-03-14

    申请号：US18504487

    申请日：2023-11-08

    Applicant: DENSO CORPORATION

    Inventor： Takanori KAWASHIMA ,  Tomomi OKUMURA ,  Shunsuke ARAI ,  Naruhiro INOUE

    IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

    CPC classification number: H01L23/3735 ,  H01L23/3142 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H02P27/06

    Abstract: A semiconductor device includes semiconductor elements arranged in a first direction, an arm connection portion disposed between the semiconductor elements in the first direction, first and second power supply terminals disposed on the same side in the first direction, first and second substrates interposing the semiconductor elements therebetween, and a sealing body. The second substrate includes an insulating base member, a front-face metal body and a back-face metal body. The front-face metal body includes a second power supply wiring and a second relay wiring. The second power supply wiring includes a base portion on which the second element is arranged, and a pair of extending portions extending from the base portion in the first direction. The second relay wiring is disposed between the extending portions in a second direction, so that the second relay wiring and the base portion satisfy a relationship of L1

    SEMICONDUCTOR DEVICE
    7.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20240079292A1

    公开(公告)日：2024-03-07

    申请号：US18504296

    申请日：2023-11-08

    Applicant: DENSO CORPORATION

    Inventor： Shingo TSUCHIMOCHI ,  Hirotoshi KUSAMA ,  Takanori KAWASHIMA

    IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

    CPC classification number: H01L23/3735 ,  H01L23/3142 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H02P27/06

    Abstract: A semiconductor device includes: a semiconductor element having main electrodes on opposite faces in a plate thickness direction; a substrate having an insulating base member, a front-face metal body disposed on a front face of the insulating base member and electrically connected to one of the main electrodes of the semiconductor element, and a back-face metal body disposed on a back face of the insulating base member; a bonding member; and a metal member connected to the front-face metal body through the bonding member. The metal member has an opposing face opposing an upper face of the front-face metal body and a receiving portion disposed adjacent to the opposing face to provide a receiving space to receive the bonding member therein. The bonding member is received in the receiving space in a state where the opposing face is in contact with the upper face of the front-face metal body.

    SEMICONDUCTOR DEVICE
    8.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220270948A1

    公开(公告)日：2022-08-25

    申请号：US17740926

    申请日：2022-05-10

    Applicant: DENSO CORPORATION

    Inventor： Hiroshi UKEGAWA ,  Takanori KAWASHIMA ,  Akinori SAKAKIBARA

    IPC: H01L23/367 ,  H01L23/373

    Abstract: The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.

    POWER CARD
    9.
    发明公开
    POWER CARD 审中-公开

    公开(公告)号：US20240032265A1

    公开(公告)日：2024-01-25

    申请号：US18481534

    申请日：2023-10-05

    Applicant: DENSO CORPORATION

    Inventor： Yuta HASHIMOTO ,  Tomohisa SANO ,  Shoichiro OMAE ,  Takanori KAWASHIMA

    IPC: H05K7/20

    CPC classification number: H05K7/20927

    Abstract: A power card, which is to be aligned in a height direction with a cooling unit in which a refrigerant flows in an inner space extending in a lateral direction, includes a plurality of switches, a resin portion, and a plurality of external connection terminals. The switches are aligned in a vertical direction perpendicular to each of the lateral direction and the height direction. The resin portion covers each of the switches. The external connection terminals are electrically connected to the respective switches and each have a portion exposed from the resin portion.

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20250062180A1

    公开(公告)日：2025-02-20

    申请号：US18938667

    申请日：2024-11-06

    Applicant: DENSO CORPORATION

    Inventor： Hiroshi UKEGAWA ,  Takanori KAWASHIMA ,  Akinori SAKAKIBARA

    IPC: H01L23/367 ,  H01L23/373

    Abstract: The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.

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