Invention Application
- Patent Title: METHOD OF FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SHIELDING LAYER
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Application No.: US17744175Application Date: 2022-05-13
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Publication No.: US20220271071A1Publication Date: 2022-08-25
- Inventor: Volume CHIEN , Su-Hua CHANG , Chia-Yu WEI , Zen-Fong HUANG , Chi-Cherng JENG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A backside illuminated image sensor device with a shielding layer and a manufacturing method thereof are provided. In the backside illuminated image senor device, a patterned conductive shielding layer is formed on a dielectric layer on a backside surface of a semiconductor substrate and surrounding a pixel array on a front side surface of the semiconductor substrate.
Public/Granted literature
- US11810939B2 Method of forming backside illuminated image sensor device with shielding layer Public/Granted day:2023-11-07
Information query
IPC分类:
