Invention Application
- Patent Title: Semiconductor Device
-
Application No.: US17590965Application Date: 2022-02-02
-
Publication No.: US20220271213A1Publication Date: 2022-08-25
- Inventor: Digh HISAMOTO , Satoru AKIYAMA , Toshiyuki MINE , Noriyuki LEE , Gou SHINKAI , Shinichi SAITO , Ryuta TSUCHIYA
- Applicant: Hitachi, Ltd
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd
- Current Assignee: Hitachi, Ltd
- Current Assignee Address: JP Tokyo
- Priority: JP2021-027123 20210224
- Main IPC: H01L39/22
- IPC: H01L39/22 ; H01L27/18 ; H01L39/24 ; G06N10/40

Abstract:
A semiconductor device includes an active region famed in a semiconductor layer formed on an insulating film famed in a semiconductor substrate and having a first extension portion extending in a first direction and a second extension portion extending in a second direction intersecting with the first direction, a first diffusion layer electrode of a first conductivity type provided in the first extension portion, second and third diffusion layer electrodes of a second conductivity type provided in the second extension portion so as to interpose a first connecting portion connecting the first extension portion and the second extension portion, a first gate electrode famed on the first extension portion between the first diffusion layer electrode and the first connecting portion through an insulating film famed on the semiconductor layer, and a second gate electrode famed on the first connecting portion through the insulating film famed on the semiconductor layer.
Information query
IPC分类: