Invention Application
- Patent Title: FLEXIBLE PRINTED BOARD AND METHOD OF PRODUCING A FLEXIBLE PRINTED BOARD
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Application No.: US17578596Application Date: 2022-01-19
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Publication No.: US20220272829A1Publication Date: 2022-08-25
- Inventor: Hidehiko Shimizu , Tomohiro Sugiura
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2021-025103 20210219
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18

Abstract:
An objective of the present invention is to prevent a copper foil used as a recognition mark from being stripped from a base film in a flexible printed board while preventing the recognition accuracy for the recognition mark from being reduced. A flexible printed board includes a base film; a copper foil pattern on the base film, wherein the copper foil pattern has a hollow shape with an outer circumferential section and an inner circumferential section and is configured to function as a recognition mark; a coverlay having an opening formed therein, wherein the coverlay is bonded to the base film and covers the outer circumferential section of the copper foil pattern such that an edge of the opening is positioned between the outer circumferential section and the inner circumferential section of the copper foil pattern.
Public/Granted literature
- US12108525B2 Flexible printed board having improved recognition accuracy Public/Granted day:2024-10-01
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