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公开(公告)号:US20250071900A1
公开(公告)日:2025-02-27
申请号:US18801015
申请日:2024-08-12
Applicant: Yazaki Corporation
Inventor: Hidehiko Shimizu , Tatsuya Oga
Abstract: A circuit body is a flexible substrate including a plurality of conductor layers having a plurality of conductor patterns and a plurality of insulating layers arranged in a manner of sandwiching the conductor layers therebetween. In each of the conductor patterns, a contact portion is provided in a first conductor layer, and is exposed to an outside through an opening provided in a first insulating layer. A plurality of the contact portions include a first contact portion belonging to the conductor pattern extending across the first conductor layer and a second conductor layer different from the first conductor layer, and a second contact portion belonging to the conductor pattern only provided on the first conductor layer and located at a position farther from a terminal end of the flexible substrate than the first contact portion. In the second conductor layer, a dummy pattern is arranged near the first contact portion.
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公开(公告)号:US11950368B2
公开(公告)日:2024-04-02
申请号:US17851504
申请日:2022-06-28
Applicant: Yazaki Corporation
Inventor: Hidehiko Shimizu , Tomohiro Sugiura
IPC: H05K1/18
CPC classification number: H05K1/189 , H05K2201/09036 , H05K2201/10037 , H05K2201/10272
Abstract: A flexible printed circuit includes: a chip component serving as an electronic component having a first electrode and the like; a base film; a conductive first pattern layer which is laminated on a portion of the base film and has a bonding region to which the electrode is, for example, soldered; and a coverlay laminated on the base film or the first pattern layer via an adhesive and having an opening for externally exposing a portion of the first pattern layer including the bonding region, and the chip component. The first pattern layer has a groove that opens in a range between the bonding region and an edge of the opening on a surface of the first pattern layer.
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公开(公告)号:US10067195B2
公开(公告)日:2018-09-04
申请号:US14965422
申请日:2015-12-10
Applicant: Yazaki Corporation
Inventor: Yuki Chiyajo , Hidehiko Shimizu , Yasutaka Wakasugi
Abstract: A first pattern and a second pattern are stacked with each other. In a pattern of a first circuit for high voltage, a GND is formed as a solid pattern. In a pattern of a second circuit for low voltage, a GND is formed as a solid pattern. The solid pattern of the GND of the pattern of the first circuit for high voltage and the solid pattern of the GND of the pattern of the second circuit for low voltage partially face each other, thereby improving noise-resistant performance of the circuit for high voltage.
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公开(公告)号:US20160247389A1
公开(公告)日:2016-08-25
申请号:US15047335
申请日:2016-02-18
Applicant: YAZAKI CORPORATION
Inventor: Hidehiko Shimizu , Haruhiko Yoshida , Ryohtaroh Murata , Yoichi Ido
CPC classification number: G08C17/02 , G08B21/182 , H01M10/4207 , H01M10/425 , H01M2220/20
Abstract: A battery monitoring device which is mounted in a vehicle and detects state information of a battery including a plurality of cells connected in series, the battery monitoring device is provided with a detection unit mounted on the battery, and a mounting member mounted on the battery. The detection unit comprises a board including a circuit for detecting the state information of the battery, and a first non-contact communication unit which is mounted on the board and performs non-contact communication via electromagnetic wave. The mounting member comprises a second non-contact communication unit which performs non-contact communication via the electromagnetic wave. The first non-contact communication unit transfers the state information of the battery to the second non-contact communication unit, and the second non-contact communication unit transfers the state information of the battery transferred from the first non-contact communication unit to a host device.
Abstract translation: 一种电池监视装置,其安装在车辆中并且检测包括串联连接的多个电池的电池的状态信息,电池监视装置设置有安装在电池上的检测单元和安装在电池上的安装构件。 检测单元包括一个板,它包括用于检测电池的状态信息的电路,以及安装在电路板上并通过电磁波进行非接触通信的第一非接触通信单元。 安装构件包括经由电磁波进行非接触通信的第二非接触通信单元。 第一非接触通信单元将电池的状态信息传送到第二非接触通信单元,第二非接触通信单元将从第一非接触通信单元传送的电池的状态信息传送到主机 设备。
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公开(公告)号:US20210360769A1
公开(公告)日:2021-11-18
申请号:US17318111
申请日:2021-05-12
Applicant: Yazaki Corporation
Inventor: Keitaroh NOZAWA , Hidehiko Shimizu , Shinji Kawai
IPC: H05K1/02
Abstract: A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.
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公开(公告)号:US12119510B2
公开(公告)日:2024-10-15
申请号:US17387304
申请日:2021-07-28
Applicant: Yazaki Corporation
Inventor: Hidehiko Shimizu , Keitaroh Nozawa , Shuhei Urakami , Shinji Kawai
IPC: H01M50/284 , H01M10/0525 , H01M50/209 , H01M50/507 , H05K1/02
CPC classification number: H01M50/284 , H01M10/0525 , H01M50/209 , H01M50/507 , H05K1/0277 , H05K2201/10037
Abstract: A battery connection module includes a plurality of bus bars provided on a battery stack in which a plurality of battery packs are assembled, and attached to electrodes of the battery packs, a flexible printed wiring board provided on the battery stack, and a first electronic component electrically connected to the flexible printed wiring board. The flexible printed wiring board includes a side surface portion which extends outward from above the battery stack and is bent so as to be fixed to a side surface of the battery stack, and the first electronic component is provided on the side surface portion.
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公开(公告)号:US20230389188A1
公开(公告)日:2023-11-30
申请号:US18320961
申请日:2023-05-19
Applicant: YAZAKI CORPORATION
Inventor: Hidehiko Shimizu
IPC: H05K1/18 , H01M50/519 , H01M50/588
CPC classification number: H05K1/189 , H01M50/519 , H01M50/588 , H05K2201/10022 , H05K2201/2009 , H05K2201/10181 , H05K2201/10272 , H05K2201/2018 , H05K2201/10636 , H05K2201/10151
Abstract: A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.
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公开(公告)号:US20220272829A1
公开(公告)日:2022-08-25
申请号:US17578596
申请日:2022-01-19
Applicant: Yazaki Corporation
Inventor: Hidehiko Shimizu , Tomohiro Sugiura
Abstract: An objective of the present invention is to prevent a copper foil used as a recognition mark from being stripped from a base film in a flexible printed board while preventing the recognition accuracy for the recognition mark from being reduced. A flexible printed board includes a base film; a copper foil pattern on the base film, wherein the copper foil pattern has a hollow shape with an outer circumferential section and an inner circumferential section and is configured to function as a recognition mark; a coverlay having an opening formed therein, wherein the coverlay is bonded to the base film and covers the outer circumferential section of the copper foil pattern such that an edge of the opening is positioned between the outer circumferential section and the inner circumferential section of the copper foil pattern.
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公开(公告)号:US20230389187A1
公开(公告)日:2023-11-30
申请号:US18320953
申请日:2023-05-19
Applicant: YAZAKI CORPORATION
Inventor: Hidehiko Shimizu
IPC: H05K1/18 , H01M50/519 , H01M50/505
CPC classification number: H05K1/189 , H01M50/519 , H01M50/505 , H05K2201/10022 , H05K2201/10151 , H05K2201/10181 , H05K2201/10272 , H05K2201/2018 , H05K2201/10636 , H05K2201/2009
Abstract: A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a metal plate that includes a frame part surrounding the electronic component and being fixed to the flexible printed wiring board; and a potting agent that is filled in a region surrounded by the frame part to cover the electronic component.
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公开(公告)号:US20200295323A1
公开(公告)日:2020-09-17
申请号:US16813653
申请日:2020-03-09
Applicant: YAZAKI CORPORATION
Inventor: Keitaro Nozawa , Kimihiro Matsuura , Hidehiko Shimizu , Haruhiko Yoshida , Yuki Chiyajo
Abstract: A battery module includes a cell module including a plurality of battery cells, a smoke exhaust duct protruding from an electrode arrangement surface of the cell module and extending along an alignment direction of the plurality of battery cells, and a circuit board arranged so as to cover the smoke exhaust duct and the electrode arrangement surface. The circuit board is arranged in an inclined state to be non-parallel to the electrode arrangement surface.
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