The present disclosure belongs to the technical field of board manufacturing, and relates to a method for preparing a weather-resistant printing board. It specifically includes the following steps: S-1, printing on at least one decorative surface of a core material layer of the board or on an overlay surface of a prefabricated wear-resistant layer to form a printed pattern layer; S-2, forming an adhesive layer between the printed pattern layer and the prefabricated wear-resistant layer or between the printed pattern layer and the core material layer; S-3, bonding the prefabricated wear-resistant layer and the core material layer to obtain the board. The peeling force of the wear-resistant layer of the outer layer of the board obtained by the present disclosure can reach at least 3 MPa, and at the same time, the prefabricated wear-resistant layer is adopted to reduce the requirements on device and production sites.