Invention Application
- Patent Title: POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN ADHESIVE LAYER, LAMINATE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
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Application No.: US17352371Application Date: 2021-06-21
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Publication No.: US20220275205A1Publication Date: 2022-09-01
- Inventor: Yung-Yu Lin , Chi-Yu Lai , Che-Wei Chang
- Applicant: eChem Solutions Corp.
- Applicant Address: TW Taoyuan
- Assignee: eChem Solutions Corp.
- Current Assignee: eChem Solutions Corp.
- Current Assignee Address: TW Taoyuan
- Priority: TW110106927 20210226
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C09J179/08 ; C08G73/10 ; C08G73/12 ; C09J7/38 ; C09J7/40
Abstract:
A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.
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