公开(公告)号：US20220275205A1

公开(公告)日：2022-09-01

申请号：US17352371

申请日：2021-06-21

Applicant: eChem Solutions Corp.

Inventor： Yung-Yu Lin ,  Chi-Yu Lai ,  Che-Wei Chang

IPC: C08L79/08 ,  C09J179/08 ,  C08G73/10 ,  C08G73/12 ,  C09J7/38 ,  C09J7/40

Abstract: A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.

公开(公告)号：US20220276559A1

公开(公告)日：2022-09-01

申请号：US17680360

申请日：2022-02-25

Applicant: eChem Solutions Corp.

Inventor： Kuan-Ming Chen ,  Chi-Yu Lai ,  Chi-sung Chen

IPC: G03F7/039 ,  G03F7/38 ,  G03F7/40 ,  G03F7/32 ,  G03F7/16 ,  G03F7/20

Abstract: A positive photosensitive resin composition for a low-temperature process includes an alkali-soluble phenolic resin, a compound with quinonediazide group, a mixed solvent and at least one additive. The mixed solvent includes a first solvent and a second solvent. The first solvent has a volatilization rate of more than 50 relative to a volatilization rate of butyl acetate of 100, and the second solvent has a boiling point between 150° C. and 200° C. The at least one additive has a molecular weight of 500-5000 and a structural unit as Formula (I), wherein R1 is selected from a group consisting of hydrogen, hydroxyl group, C1-C5 alkyl group, phenyl group, halogen atoms and cyano group, R2 is selected from a group consisting of hydrogen, acid radical, benzene and derivatives thereof, phenols, benzoic acid and derivatives thereof and aromatic heterocycles, and n is 10-80. It is also provided a method for preparing a photoresist film

公开(公告)号：US12157815B2

公开(公告)日：2024-12-03

申请号：US17352371

申请日：2021-06-21

Applicant: eChem Solutions Corp.

Inventor： Yung-Yu Lin ,  Chi-Yu Lai ,  Che-Wei Chang

IPC: C08L79/08 ,  C08G73/10 ,  C08G73/12 ,  C09J7/38 ,  C09J7/40 ,  C09J179/08

Abstract: A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.

公开(公告)号：US20210223699A1

公开(公告)日：2021-07-22

申请号：US17141228

申请日：2021-01-05

Applicant: eChem Solutions Corp.

Inventor： Tz-Jin Yang ,  Yung-Yu Lin ,  Chi-Yu Lai ,  Ming-Che Chung ,  Che-Wei Chang

IPC: G03F7/34 ,  G03F7/037 ,  G03F7/038 ,  G03F7/00 ,  C08G73/10 ,  G03F7/42

Abstract: A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.