Invention Application
- Patent Title: MONITORING APPARATUS AND METHOD
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Application No.: US17577883Application Date: 2022-01-18
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Publication No.: US20220276077A1Publication Date: 2022-09-01
- Inventor: Morteza Safai
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: G01D7/00
- IPC: G01D7/00 ; H04W4/80

Abstract:
Systems, apparatuses and methods provide for technology that monitors a component. A monitoring apparatus includes a sensor to monitor a state of a component, a power circuit to convert an electromagnetic signal to electrical power, a capacitor bank coupled to the power circuit and to the sensor to receive electrical power from the power circuit and to supply electrical power to the sensor, and a wireless readout to convert data from the sensor into a wireless communication signal. A method of monitoring a component includes coupling a sensor to a component, the sensor configured to monitor a state of the component, applying power to the sensor from a capacitor bank, and storing data obtained from the sensor, where the data relates to a state of the component. The method can include charging the capacitor bank via a power circuit, where the power circuit converts an electromagnetic signal to electrical power.
Public/Granted literature
- US12140458B2 Monitoring apparatus and method Public/Granted day:2024-11-12
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