Invention Application
- Patent Title: MULTILAYER COIL COMPONENT
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Application No.: US17666170Application Date: 2022-02-07
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Publication No.: US20220277879A1Publication Date: 2022-09-01
- Inventor: Yusuke NAGAI , Hidekazu SATO , Kazuhiro EBINA , Kunihiko KAWASAKI , Takahiro SATO , Kouichi KAKUDA , Yuya ISHIMA , Shinichi KONDO , Shinichi SATO , Masaki TAKAHASHI
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2021-031806 20210301
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/29

Abstract:
In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |