中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.013 seconds)

    MULTILAYER COIL COMPONENT
    1.
    发明申请
    MULTILAYER COIL COMPONENT 审中-公开

    公开(公告)号：US20200234873A1

    公开(公告)日：2020-07-23

    申请号：US16746178

    申请日：2020-01-17

    Applicant: TDK Corporation

    Inventor： Hajime KATO ,  Hidekazu SATO ,  Makoto YOSHINO ,  Kazuya TOBITA ,  Yuto SHIGA ,  Youichi KAZUTA ,  Noriaki HAMACHI

    IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04

    Abstract: A multilayer coil component 1 includes an element body 2, a coil 8, and a terminal electrode 4 and a terminal electrode 5. Each of the terminal electrode 4 and the terminal electrode 5 is disposed over at least the end surfaces 2a and 2b and a main surface 2d. Each of the terminal electrode 4 and the terminal electrode 5 and at least a part of the coil 8 overlap when viewed from the facing direction of the pair of side surfaces 2e and 2f. Each of the terminal electrode 4 and the terminal electrode 5 and the coil 8 do not overlap when viewed from the facing direction of the pair of end surfaces 2a and 2b.

    ELECTRONIC COMPONENT
    3.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20170309389A1

    公开(公告)日：2017-10-26

    申请号：US15488876

    申请日：2017-04-17

    Applicant: TDK CORPORATION

    Inventor： Shinichi SATO ,  Yohei TADAKI ,  Akihiko OIDE ,  Yuma ISHIKAWA ,  Hidekazu SATO ,  Kazuhiro EBINA ,  Hiroyuki TANOUE

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

    MULTILAYER COIL COMPONENT
    5.
    发明申请
    MULTILAYER COIL COMPONENT 审中-公开

    公开(公告)号：US20190096561A1

    公开(公告)日：2019-03-28

    申请号：US16136944

    申请日：2018-09-20

    Applicant: TDK CORPORATION

    Inventor： Yusuke NAGAI ,  Takashi SUZUKI ,  Hidekazu SATO ,  Takashi ENDO ,  Kouichi KAKUDA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Yuya ISHIMA ,  Shinichi SATO ,  Masaki TAKAHASHI

    IPC: H01F17/00 ,  H01F27/34 ,  H01F41/04 ,  H01F17/04

    Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.

    ELECTRONIC COMPONENT
    7.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20230005656A1

    公开(公告)日：2023-01-05

    申请号：US17945396

    申请日：2022-09-15

    Applicant: TDK CORPORATION

    Inventor： Shinichi SATO ,  Yohei TADAKI ,  Akihiko OIDE ,  Yuma ISHIKAWA ,  Hidekazu SATO ,  Kazuhiro EBINA ,  Hiroyuki TANOUE

    IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

    MULTILAYER COIL COMPONENT
    9.
    发明申请
    MULTILAYER COIL COMPONENT 审中-公开

    公开(公告)号：US20200234874A1

    公开(公告)日：2020-07-23

    申请号：US16746276

    申请日：2020-01-17

    Applicant: TDK CORPORATION

    Inventor： Hajime KATO ,  Hidekazu SATO ,  Makoto YOSHINO ,  Kazuya TOBITA ,  Yuto SHIGA ,  Youichi KAZUTA ,  Noriaki HAMACHI

    IPC: H01F27/29 ,  H01F27/28

    Abstract: A multilayer coil component 1 includes four terminal electrodes 3, 4, 5, and 6. A part of the coil 8 as viewed from the facing direction of a pair of main surfaces 2c and 2d is disposed in at least one of first and second regions A1 and A2 formed between the pair of terminal electrodes 3 and 4 and the pair of terminal electrodes 5 and 6 disposed so as to face each other in the facing direction of the pair of side surfaces 2e and 2f and third and fourth regions formed between the pair of terminal electrodes 3 and 5 and the pair of terminal electrodes 4 and 6 disposed so as to face each other in the facing direction of the pair of end surfaces 2a and 2b.

Patent Agency Ranking