Invention Application
- Patent Title: SUBSTRATE POLISHING SYSTEM
-
Application No.: US17575913Application Date: 2022-01-14
-
Publication No.: US20220277963A1Publication Date: 2022-09-01
- Inventor: Hee Sung Chae , Seung Eun Lee , Geun Sik Yun
- Applicant: KCTech Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: KCTech Co., Ltd.
- Current Assignee: KCTech Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2021-0026892 20210226
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/687 ; H01L21/67 ; H01L21/677 ; H01L21/673
Abstract:
A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.
Information query
IPC分类:
