- 专利标题: ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT
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申请号: US17637942申请日: 2020-08-05
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公开(公告)号: US20220283516A1公开(公告)日: 2022-09-08
- 发明人: Mohamed SWILLAM , Stephen ROUX , Tamer Mohamed Tawfik Ah ELAZHARY , Arie Jeffrey DEN BOEF
- 申请人: ASML Holding N.V. , ASML Netherlands B.V.
- 申请人地址: NL Veldhoven; NL Veldhoven
- 专利权人: ASML Holding N.V.,ASML Netherlands B.V.
- 当前专利权人: ASML Holding N.V.,ASML Netherlands B.V.
- 当前专利权人地址: NL Veldhoven; NL Veldhoven
- 国际申请: PCT/EP2020/072063 WO 20200805
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G02B6/122 ; G02B26/08
摘要:
A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.
公开/授权文献
- US12066762B2 On chip sensor for wafer overlay measurement 公开/授权日:2024-08-20
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