Invention Application
- Patent Title: ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT
-
Application No.: US17637942Application Date: 2020-08-05
-
Publication No.: US20220283516A1Publication Date: 2022-09-08
- Inventor: Mohamed SWILLAM , Stephen ROUX , Tamer Mohamed Tawfik Ah ELAZHARY , Arie Jeffrey DEN BOEF
- Applicant: ASML Holding N.V. , ASML Netherlands B.V.
- Applicant Address: NL Veldhoven; NL Veldhoven
- Assignee: ASML Holding N.V.,ASML Netherlands B.V.
- Current Assignee: ASML Holding N.V.,ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven; NL Veldhoven
- International Application: PCT/EP2020/072063 WO 20200805
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G02B6/122 ; G02B26/08

Abstract:
A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.
Public/Granted literature
- US12066762B2 On chip sensor for wafer overlay measurement Public/Granted day:2024-08-20
Information query
IPC分类: