Invention Application
- Patent Title: Method for Measuring Full-Field Strain of an Ultra-High Temperature Object Based on Digital Image Correlation Method
-
Application No.: US17388131Application Date: 2021-07-29
-
Publication No.: US20220284558A1Publication Date: 2022-09-08
- Inventor: Shenghong Huang , Zhiwei Pan , Menglai Jiang , Zhifeng Zheng , Meixia Qiao
- Applicant: University of Science and Technology of China
- Applicant Address: CN Hefei
- Assignee: University of Science and Technology of China
- Current Assignee: University of Science and Technology of China
- Current Assignee Address: CN Hefei
- Priority: CN202011075812.4 20201010
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01L1/24 ; H04N17/00 ; H04N5/72 ; H04N13/25

Abstract:
The present disclosure relates to a method for measuring full-field strain of an ultra-high temperature (UHT) object based on a digital image correlation method. The temperature range is from normal temperature to 3500 degrees Celsius. The method includes the steps of selecting a proper high-temperature-resistant speckle material, tantalum carbide powder, according to the characteristics of the object to be measured. First, polishing a to-be-measured surface of a tungsten test piece to remove an oxide layer, then mixing the tantalum carbide (TaC) powder and absolute ethanol to form a paste according to a mass ratio of 1:2. Making randomly distributed speckles from the mixture on the to-be-measured surface of the test piece which has been processed. In order to improve firmness and stability of the newly made speckles, performing curing treatment to the speckles.
Public/Granted literature
Information query