Invention Application
- Patent Title: INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
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Application No.: US17752037Application Date: 2022-05-24
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Publication No.: US20220285293A1Publication Date: 2022-09-08
- Inventor: Vivek Swaminathan Sridharan , Yiqi Tang , Christopher Daniel Manack , Rajen Manicon Murugan , Liang Wan , Hiep Xuan Nguyen
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/60
- IPC: H01L23/60 ; H01L23/495 ; H01L23/00 ; H01L33/00 ; H01L33/62

Abstract:
A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.
Public/Granted literature
- US11978709B2 Integrated system-in-package with radiation shielding Public/Granted day:2024-05-07
Information query
IPC分类: