Invention Application
- Patent Title: METHODS AND SYSTEMS FOR FILLING A GAP
-
Application No.: US17680607Application Date: 2022-02-25
-
Publication No.: US20220293463A1Publication Date: 2022-09-15
- Inventor: René Henricus Jozef Vervuurt , Timothee Blanquart , Viljami Pore , Giuseppe Alessio Verni , Qi Xie , Ren-Jie Chang , Eric James Shero
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/02

Abstract:
Disclosed are methods and systems for filling a gap. An exemplary method comprises providing a substrate to a reaction chamber. The substrate comprises the gap. The method further comprises at least partially filling the gap with a gap filling fluid. The method then comprises subjecting the gap filling fluid to a transformation treatment, thus forming a transformed material in the gap. The methods and systems are useful, for example, in the field of integrated circuit manufacture.
Information query
IPC分类: