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公开(公告)号:US12087586B2
公开(公告)日:2024-09-10
申请号:US17227621
申请日:2021-04-12
申请人: ASM IP Holding B.V.
IPC分类号: H01L21/28 , C23C16/34 , C23C16/455 , C23C16/52 , H01L29/49
CPC分类号: H01L21/28088 , C23C16/34 , C23C16/45544 , C23C16/52 , H01L29/4966
摘要: Methods and systems for depositing chromium nitride layers onto a surface of the substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a deposition process, depositing a chromium nitride layer onto a surface of the substrate. The deposition process can include providing a chromium precursor to the reaction chamber and separately providing a nitrogen reactant to the reaction chamber. The deposition process may be a thermal cyclical deposition process.
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公开(公告)号:US20240209505A1
公开(公告)日:2024-06-27
申请号:US18423969
申请日:2024-01-26
申请人: ASM IP Holding B.V.
发明人: William Petro , Venkata Motupalli , Pawan Sharma , Ankit Kimtee , Eric James Shero , Todd Robert Dunn
IPC分类号: C23C16/52 , C23C16/455
CPC分类号: C23C16/52 , C23C16/45544
摘要: A precursor monitoring assembly for use in reactor systems to provide real-time and direct measurements of the availability of source materials from a source vessel. The assembly includes one or more force or load sensors, such as load cells, positioned between a bottom wall of an interior tray and an exterior wall (e.g., a base of a source vessel) and/or outside the source vessel. A signal conditioning element processes the output electrical signals from the sensors, then a controller processes the output signals from the signal conditioning components with a conversion factor, for example, to determine a current weight of source material stored in the source vessel. The controller uses this weight to calculate the amount of available source material or chemistry in the source vessel.
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公开(公告)号:US20240209501A1
公开(公告)日:2024-06-27
申请号:US18596144
申请日:2024-03-05
申请人: ASM IP Holding B.V.
IPC分类号: C23C16/448 , C23C16/455
CPC分类号: C23C16/4481 , C23C16/45544
摘要: Herein disclosed are systems and methods related to solid source chemical vaporizer vessels and multiple chamber deposition modules. In some embodiments, a solid source chemical vaporizer includes a housing base and a housing lid. Some embodiments also include a first and second tray configured to be housed within the housing base, wherein each tray defines a first serpentine path adapted to hold solid source chemical and allow gas flow thereover. In some embodiments, a multiple chamber deposition module includes first and second vapor phase reaction chambers and a solid source chemical vaporizer vessel to supply each of the first and second vapor phase reaction chambers.
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公开(公告)号:US20240165681A1
公开(公告)日:2024-05-23
申请号:US18509375
申请日:2023-11-15
申请人: ASM IP Holding B.V.
发明人: Jereld Lee Winkler , Paul Ma , Eric James Shero , Shubham Garg , Jonathan Bakke , Todd Dunn , Jacqueline Wrench , Shuaidi Zhang
CPC分类号: B08B9/0813 , B08B9/46 , B08B2209/08
摘要: Various embodiments of the present technology may provide methods and apparatus for cleaning a source vessel. The source vessel may be filled or partially filled with a solvent to form a solution. The solution is removed from the source vessel and contained in a waste vessel that is connected to the source vessel. The waste vessel may have a bellow or other mechanism inside of it to create a negative pressure in the waste vessel to pull the solution out of the source vessel and into the waste vessel. Alternatively, a liquid pump may be used to pull the solution from the source vessel to the waste vessel.
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公开(公告)号:US11976361B2
公开(公告)日:2024-05-07
申请号:US17714383
申请日:2022-04-06
申请人: ASM IP Holding B.V.
发明人: Eric James Shero , Robert Brennan Milligan , William George Petro , Eric Wang , Fred Alokozai , Dong Li , Hao Wang , Melvin Verbaas , Luping Li
IPC分类号: C23C16/455 , C23C16/34 , C23C16/44 , C23C16/46 , C23C16/52
CPC分类号: C23C16/45565 , C23C16/34 , C23C16/4401 , C23C16/45544 , C23C16/46 , C23C16/52
摘要: An apparatus and method for depositing a transition metal nitride film on a substrate by atomic layer deposition in a reaction space defined by an at least one chamber wall and showerhead is disclosed. The apparatus may include, a substrate support disposed within the reaction space, the substrate support configured for supporting at least one substrate and a temperature control system for controlling a temperature of the at least one chamber wall at those portions of the at least one chamber wall that is exposed to a vapor phase reactant. The apparatus may also include a temperature control system for controlling a temperature of the showerhead, wherein the temperature control system for controlling a temperature of the showerhead is configured to control the temperature of the showerhead to a temperature of between approximately 80° C. and approximately 160° C. The method may include, providing at least one substrate on a substrate support within the reaction space and controlling a temperature of the at least one chamber wall at least at those portions of the at least one chamber wall that is exposed to a vapor phase reactant and controlling a temperature of a showerhead. The method may also include, alternatively and sequentially feeding at least two vapor phase reactants into the reaction space, wherein the temperature of the showerhead is controlled to a temperature between approximately 80° C. and approximately 160° C.
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公开(公告)号:US11967488B2
公开(公告)日:2024-04-23
申请号:US17744902
申请日:2022-05-16
申请人: ASM IP Holding B.V.
发明人: Suvi Haukka , Eric James Shero , Fred Alokozai , Dong Li , Jereld Lee Winkler , Xichong Chen
CPC分类号: H01J37/32495 , C23C16/32 , C23C16/4404 , C23C16/4405
摘要: A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.
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公开(公告)号:US11959168B2
公开(公告)日:2024-04-16
申请号:US17239768
申请日:2021-04-26
申请人: ASM IP Holding B.V.
IPC分类号: C23C16/455 , C23C16/44 , C23C16/448 , C23C16/50
CPC分类号: C23C16/448 , C23C16/44 , C23C16/4408 , C23C16/45525 , C23C16/50
摘要: The present disclosure is generally directed to a solid source precursor delivery system. More specifically, the present disclosure is directed to a solid source precursor vessel that can be utilized to vaporize a supply of solid precursor stored within the vessel. The disclosed source vessel utilizes a plurality of individual cavities or pockets within the interior of the vessel. Each individual pocket may be loaded with precursor. In an arrangement, the pockets may be loaded with pre-formed blocks of compressed precursor material that typically have a higher density than was previously achieved when packing solid precursor within a source vessel. The increased density of the solid precursor material increases a capacity of the source vessel resulting in longer intervals between replacement and/or refilling the source vessel.
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公开(公告)号:US11873557B2
公开(公告)日:2024-01-16
申请号:US17504839
申请日:2021-10-19
申请人: ASM IP Holding B.V.
IPC分类号: C23C16/06 , C23C16/455 , C23C16/52
CPC分类号: C23C16/45534 , C23C16/45553 , C23C16/52
摘要: The manufacture of semiconductor devices may include methods of forming vanadium metal on a substrate. The methods comprise providing a substrate in a reaction chamber, providing a vanadium precursor to the reaction chamber in a vapor phase and providing a reducing agent to the reaction chamber in a vapor phase to form vanadium metal on the substrate.
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公开(公告)号:US20240014012A9
公开(公告)日:2024-01-11
申请号:US17744902
申请日:2022-05-16
申请人: ASM IP Holding B.V.
发明人: Suvi Haukka , Eric James Shero , Fred Alokozai , Dong Li , Jereld Lee Winkler , Xichong Chen
CPC分类号: H01J37/32495 , C23C16/4405 , C23C16/4404 , C23C16/32
摘要: A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.
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公开(公告)号:US11742198B2
公开(公告)日:2023-08-29
申请号:US16802920
申请日:2020-02-27
申请人: ASM IP Holding B.V.
IPC分类号: C23C16/36 , C23C16/455 , H01L21/02 , H01L21/768
CPC分类号: H01L21/02126 , C23C16/36 , C23C16/45553 , H01L21/0228 , H01L21/02274 , H01L21/76829
摘要: A method for forming a layer comprising SiOCN on a substrate is disclosed. An exemplary method includes thermally depositing the layer comprising SiOCN on a surface of the substrate. The layer comprising SiOCN can be used for various applications, including spacers, etch stop layers, and etch resistant layers.
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