- 专利标题: WIDE CHANNEL SEMICONDUCTOR DEVICE
-
申请号: US17830707申请日: 2022-06-02
-
公开(公告)号: US20220293650A1公开(公告)日: 2022-09-15
- 发明人: Chia-Yu WEI , Fu-Cheng CHANG , Hsin-Chi CHEN , Ching-Hung KAO , Chia-Pin CHENG , Kuo-Cheng LEE , Hsun-Ying HUANG , Yen-Liang LIN
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H01L29/423 ; H01L29/78 ; H01L29/06
摘要:
A semiconductor device includes a plurality of isolation structures, wherein each isolation structure of the plurality of isolation structures is spaced from an adjacent isolation structure of the plurality of isolation structures in a first direction. The semiconductor device further includes a gate structure. The gate structure includes a top surface; a first sidewall angled at a non-perpendicular angle with respect to the top surface; and a second sidewall angled with respect to the top surface. The gate structure further includes a first horizontal surface extending between the first sidewall and the second sidewall, wherein the first horizontal surface is parallel to the top surface, and a dimension of the gate structure in a second direction, perpendicular to the first direction, is less than a dimension of each of the plurality of isolation structures in the second direction.
公开/授权文献
- US11784198B2 Wide channel semiconductor device 公开/授权日:2023-10-10
信息查询
IPC分类: