Invention Application
- Patent Title: GLASS MOUNTED ELECTRONIC ASSEMBLY
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Application No.: US17569079Application Date: 2022-01-05
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Publication No.: US20220294164A1Publication Date: 2022-09-15
- Inventor: M. Jarod Scherer , Stefanie Merry , Tyler Folger
- Applicant: Aptiv Technologies Limited
- Applicant Address: BB St. Michael
- Assignee: Aptiv Technologies Limited
- Current Assignee: Aptiv Technologies Limited
- Current Assignee Address: BB St. Michael
- Main IPC: H01R24/50
- IPC: H01R24/50 ; H05K5/00 ; H01R43/20 ; H05K1/14 ; H05K1/18 ; H01Q1/12 ; H01Q1/24

Abstract:
An electronic assembly includes a circuit board having a plurality of conductive traces and electronic components forming an electronic circuit disposed thereon, a plurality of flexible electrical terminals configured to attach to electrical contacts disposed on a glass surface and electrically connected to the plurality of conductive traces, and a coaxial cable connector electrically connected to the plurality of conductive traces. A method of manufacturing an electronic assembly, e.g., the electronic assembly described above, is also presented herein.
Public/Granted literature
- US12126126B2 Glass mounted electronic assembly Public/Granted day:2024-10-22
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