- 专利标题: Glass mounted electronic assembly
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申请号: US17569079申请日: 2022-01-05
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公开(公告)号: US12126126B2公开(公告)日: 2024-10-22
- 发明人: M. Jarod Scherer , Stefanie Merry , Tyler Folger
- 申请人: Aptiv Technologies AG
- 申请人地址: CH Schaffhausen
- 专利权人: APTIV TECHNOLOGIES AG
- 当前专利权人: APTIV TECHNOLOGIES AG
- 当前专利权人地址: CH Schaffhausen
- 代理机构: Billion & Armitage
- 主分类号: H01R24/00
- IPC分类号: H01R24/00 ; H01Q1/12 ; H01Q1/24 ; H01R24/50 ; H01R43/20 ; H05K1/14 ; H05K1/18 ; H05K5/00 ; H01R12/52 ; H01R12/55
摘要:
An electronic assembly includes a circuit board having a plurality of conductive traces and electronic components forming an electronic circuit disposed thereon, a plurality of flexible electrical terminals configured to attach to electrical contacts disposed on a glass surface and electrically connected to the plurality of conductive traces, and a coaxial cable connector electrically connected to the plurality of conductive traces. A method of manufacturing an electronic assembly, e.g., the electronic assembly described above, is also presented herein.
公开/授权文献
- US20220294164A1 GLASS MOUNTED ELECTRONIC ASSEMBLY 公开/授权日:2022-09-15
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