Invention Application
- Patent Title: DETECTING DEFECTS IN SEMICONDUCTOR SPECIMENS USING WEAK LABELING
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Application No.: US17751507Application Date: 2022-05-23
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Publication No.: US20220301151A1Publication Date: 2022-09-22
- Inventor: Irad PELEG , Ran SCHLEYEN , Boaz Cohen
- Applicant: Applied Materials Israel Ltd.
- Applicant Address: IL Rehovot
- Assignee: Applied Materials Israel Ltd.
- Current Assignee: Applied Materials Israel Ltd.
- Current Assignee Address: IL Rehovot
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01N21/95 ; G06T7/11 ; G06N3/06 ; G06K9/62 ; G06V10/75

Abstract:
A system of classifying a pattern of interest (POI) on a semiconductor specimen, the system comprising a processor and memory circuitry configured to: obtain a high-resolution image of the POI, and generate data usable for classifying the POI in accordance with a defectiveness-related classification, wherein the generating utilizes a machine learning model that has been trained in accordance with training samples comprising: a high-resolution training image captured by scanning a respective training pattern on a specimen, the respective training pattern being similar to the POI, and a label associated with the image, the label being derivative of low-resolution inspection of the respective training pattern.
Public/Granted literature
- US11790515B2 Detecting defects in semiconductor specimens using weak labeling Public/Granted day:2023-10-17
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