A semiconductor package includes: a first die; a second die stacked on an upper surface of the first die, the second die including a second semiconductor substrate and a second seal ring structure that extends along a perimeter of the second semiconductor substrate; a third die stacked on the upper surface of the first die, the third die including a third semiconductor substrate and a third seal ring structure that extends along a perimeter of the third semiconductor substrate; and a connection circuit that extends through the second seal ring structure and the third seal ring structure, in a lateral direction perpendicular to the stacking direction of the first die and the second die, to electrically connect the second semiconductor substrate and the third semiconductor substrate.