Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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Application No.: US17580847Application Date: 2022-01-21
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Publication No.: US20220302274A1Publication Date: 2022-09-22
- Inventor: JUYOUN KIM , HYUNG JONG LEE , SEULGI YUN , SEKI HONG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR SUWON-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR SUWON-Si
- Priority: KR10-2021-0035442 20210318,KR10-2021-0052673 20210422
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/092

Abstract:
A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.
Public/Granted literature
- US11978779B2 Semiconductor device and method of fabricating the same Public/Granted day:2024-05-07
Information query
IPC分类: