Invention Application
- Patent Title: POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
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Application No.: US17617877Application Date: 2020-06-10
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Publication No.: US20220306838A1Publication Date: 2022-09-29
- Inventor: Guillaume VINCENT , Stéphane BIZET , Clémence PACE , Marie POMMIER DE SANTI
- Applicant: Arkema France
- Applicant Address: FR Colombes
- Assignee: Arkema France
- Current Assignee: Arkema France
- Current Assignee Address: FR Colombes
- Priority: FRFR1906183 20190611
- International Application: PCT/FR2020/050986 WO 20200610
- Main IPC: C08K7/28
- IPC: C08K7/28 ; C08K7/14 ; B29C45/00

Abstract:
The use of a mixture of solid and hollow glass reinforcements with an alloy of at least one polyamide and at least one polyolefin, the mixture of solid and hollow glass reinforcements including from 5 to 50% by weight of hollow glass beads relative to the total of solid and hollow glass reinforcements for the dry preparation at 23° C. of a composition having a modulus at least equal to 8 GPa and a dielectric constant Dk less than or equal to 3.5 as measured according to ASTM D-2520-13, at a frequency of at least 1 GHz, at 23° C., under 50% RH.
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