Invention Application
- Patent Title: SENSOR DEVICE
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Application No.: US17698459Application Date: 2022-03-18
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Publication No.: US20220307918A1Publication Date: 2022-09-29
- Inventor: Miki YAZAWA
- Applicant: KOA CORPORATION
- Applicant Address: JP Nagano
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP Nagano
- Priority: JP2021-049692 20210324
- Main IPC: G01K7/24
- IPC: G01K7/24 ; G01K1/08

Abstract:
A sensor device according to the present invention includes: a sensor element including a temperature-sensitive resistor; and a protective cover that protects the sensor element, wherein the sensor element has a shape extending long along one direction, and the protective cover surrounds a periphery of the sensor element with a plurality of support pillars extending obliquely with respect to a longitudinal direction of the sensor element. It is preferable that the plurality of support pillars intersect in a lattice-like manner.
Public/Granted literature
- US12270716B2 Sensor device Public/Granted day:2025-04-08
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